Stamped and Formed, Dual-Wipe
Brands | 3M™ |
Contact Base Material | Phosphor Bronze |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Metric) | 0.89 µm |
Current Rating | 1.0 |
Frame Style/Type | Open |
Insulation Material | Glass Filled Polyester |
Integrated Circuit Type | DIP |
Mating Contact Finish Material | Matte Tin |
Mating Contact Finish Thickness (Metric) | 3.43 µm |
Maximum Operating Temperature (Celsius) | 85 ℃ |
Minimum Operating Temperature (Celsius) | -25 ℃ |
Number of Contact Rows | 2 |
Number of Contacts | 14 |
PCB Mounting Style | Through Hole |
Pitch (Metric) | 2.54 mm |
Tech Sheet Number | TS-1099 |
3D Models
(ZIP, 90KB)
3D Models
(ZIP, 197KB)