3M™ Chip Carrier Sockets, 8400 Series, 8444-21A1-RK-TP
- 3M ID 80000905408
Details
Highlights
- Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular
- High temperature insulator compatible with IR reflow and wave soldering
- Compatible with automated loading equipment
- Open top design allows unrestricted air flow
- Molded slots for ease of device extraction
- Available with optional PCB locating posts
- RoHS Compliant. See Regulatory Information Appendix link for chemical compliance information
- For more information, refer to Data Sheet TS2147 (TS-2147)
Surfacemount chip carrier socket
Specifications
| Brands | 3M™ |
| Contact Base Material | Copper Alloy |
| Contact Underplating Material | Nickel |
| Contact Underplating Thickness (Metric) | 1.27 µm |
| Current Rating | 1.0 |
| Frame Style/Type | Closed |
| Insulation Material | Glass Filled Polyphenylene Sulfide (PPS) |
| Integrated Circuit Type | PLCC |
| Mating Contact Finish Material | Matte Tin |
| Mating Contact Finish Thickness (Metric) | 4.06 µm |
| Maximum Operating Temperature (Celsius) | 105 ℃ |
| Minimum Operating Temperature (Celsius) | -40 ℃ |
| Number of Contact Rows | 4 |
| Number of Contacts | 44 |
| PCB Mounting Style | Surface Mount |
| Pitch (Metric) | 1.27 mm |
| Tech Sheet Number | TS-2147 |
Resources
8428-21A1-xx-xx, 3D IGES, rev. 013D Models
(ZIP, 427KB)
3D Models
(ZIP, 205KB)
