3M™ High-Speed Card-Edge Connector, SPD08 Series, SPD08-020-RB-TR
- 3M ID XA003832871
Details
Highlights
- Card-edge high-speed board-to-board connector
- Supports flexible stacking height (16-40 mm) mezzanine applications using a riser card
- High-density (0.8 mm pitch), two-row design conserves board space and simplifies trace routing
- Robust contact design is tolerant of misalignment, provides a reliable connection and supports blind mate applications
- Controlled impedance, crosstalk limiting contact design supports speeds up to 15 Gbps
- Embedded ground plane within riser card limits row to row crosstalk and enhances signal integrity
- Supports up to 25 Gbps wire to board applications using 3M™ Twin Axial Cable terminated to the card-edge
- Flexible design supports 20-200 contact positions
- Available with optional latches for robust mechanical stability
- 0.5A current rating per contact
- Typically used in datacom, enterprise servers, telecom, industrial, test and military applications
- Supports XAUI, PCI express (Gen 1/2/3), SATA and other application speeds
0.8 mm, Card-Edge, SMT
3M™ High-Speed Card-Edge Connector, SPD08 Series has high speed transmission performance. Offers flexible stack height, with robust tolerance for misalignment, and a current carrying capacity of up to 3.0A.
Specifications
| Brands | 3M™ |
| Card Standard | Dual Edge |
| Connector Style | Receptacle |
| Current Rating | 1.2 |
| Features | Board Guide, Cantilever |
| Mating Contact Finish Material | Gold |
| Mating Contact Finish Thickness (Metric) | 0.76 µm |
| Maximum Operating Temperature (Celsius) | 125 ℃ |
| Minimum Operating Temperature (Celsius) | -55 ℃ |
| Mounting Type | Boardmount |
| Number of Contact Rows | 2 |
| Number of Contacts | 20 |
| Packaged Form | Tape & Reel |
| Product Colour | Black |
| Product Series | SPD08 |
| Tech Sheet Number | TS-2420 |
Resources
SPD08-020-L-XX-XX, 3D Parasolid, rev. 013D Models
(ZIP, 225KB)
3D Models
(ZIP, 453KB)
