3M™ Chip Carrier Sockets, 8400 Series, 8428-11B1-RK-TP

  • 3M ID 80000905242

Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular

Compatible with automated loading equipment

Open top design allows unrestricted air flow

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PDF (1) Copy 26Tech Data Sheet (PDF, 139KB)

Details

Highlights
  • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular
  • Compatible with automated loading equipment
  • Open top design allows unrestricted air flow
  • Molded slots for ease of device extraction
  • Wave solder compatible. Not suitable for reflow soldering
  • RoHS Compliant. See Regulatory Information Appendix link for chemical compliance information
  • For more information, refer to Data Sheet TS2148 (TS-2148)

Low Profile, Four-Row, Through-Hole

Specifications

Brands

3M™

Contact Base Material

Copper Alloy

Contact Underplating Material

Nickel

Contact Underplating Thickness (Metric)

1.27 µm

Current Rating

1.0

Frame Style/Type

Closed

Insulation Material

Glass Filled Polyester (PBT)

Integrated Circuit Type

PLCC

Mating Contact Finish Material

Matte Tin

Mating Contact Finish Thickness (Metric)

4.06 µm

Maximum Operating Temperature (Celsius)

105 ℃

Minimum Operating Temperature (Celsius)

-40 ℃

Number of Contact Rows

4

Number of Contacts

28

PCB Mounting Style

Through Hole

Pitch (Metric)

1.27 mm

Tech Sheet Number

TS-2148

Resources