3M™ Diamond Pad Conditioner A165, 4.25-in dia

  • Part Number A165
  • 3M ID 60020015859
Carrier Diameter (Metric) 107.95 mm
CMP Process Cu (Bulk), W (Bulk), STI Process, PMD/ILD
Diamond Size 251 micron

Optimized for extended pad and disk life

Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership

Diamonds secured with both chemical and mechanical bonds for great retention

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Details

Highlights
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
  • Customizable for conditioning aggressiveness
  • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.

Set of icons representing the recommended applications of Advanced Node, CMP, Hard Disk Manufacturing and Wafer Manufacturing
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    Specifications

    Abrasive Working Surface

    Full Face

    Applications

    Advanced Node (Memory & Logic), Wafer Manufacturing, Hard Disk Drive Manufacturing, CMP

    Brands

    3M™

    CMP Process

    Cu (Bulk), W (Bulk), STI Process, PMD/ILD

    Carrier Diameter (Metric)

    107.95 mm

    Carrier Form

    Disc (Beveled Edge)

    Carrier Material

    304 Stainless Steel

    Diamond Size

    251 micron

    Mineral Type

    Nickel-based Alloy with Patterned Diamond

    Product Series

    A165

    Product Type

    Diamond Pad Conditioner

    Resources

    Similar products

    Carrier Diameter (Metric) 107.95 mm
    CMP Process Cu (Bulk), W (Bulk), STI Process, PMD/ILD
    Diamond Size 251 micron