3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.
Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
Abrasive Working Surface | Full Face |
Applications | Advanced Node (Memory & Logic), Wafer Manufacturing, Hard Disk Drive Manufacturing, CMP |
Brands | 3M™ |
CMP Process | Cu (Bulk), W (Bulk), STI Process, PMD/ILD |
Carrier Diameter (Metric) | 107.95 mm |
Carrier Form | Disc (Beveled Edge) |
Carrier Material | 304 Stainless Steel |
Diamond Size | 251 micron |
Mineral Type | Nickel-based Alloy with Patterned Diamond |
Product Series | A165 |
Product Type | Diamond Pad Conditioner |
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